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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating  Solution

Scientific Article | Ici, l’accumulation des ions cuivreux dans une solution en une expérience de modèle et d’une analyse fondée sur des mesures
Knowledge of the behavior of cuprous ions (monovalent copper ion: Cu(I)) in a copper sulfate plating bath is important for improving the plating process.

Electrodeposition of Copper for Three-Dimensional Metamaterial Fabrication

Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution

Figure 6 from Analysis of Cu(I) in Copper Sulfate Electroplating Solution

Absorption spectra in electrolysis solutions (a) phosphoruscontaining

A novel method of rapid detection for heavy metal copper ion via a specific copper chelator bathocuproinedisulfonic acid disodium salt

A novel method of rapid detection for heavy metal copper ion via a specific copper chelator bathocuproinedisulfonic acid disodium salt

Electrochemistry of Copper in Polyacrylic Acid: The Electrode Mechanism and Analytical Application for Gaseous Hydrogen Peroxide Detection

Selective determination of cuprous ion in copper dissolving solution based on bathocuproine-modified expanded graphite electrode

CN103668357A - Alkaline cyanide-free high-speed copper plating solution - Google Patents

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