MacroVoids in assembled BGA packages

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C.

Recent developments in advanced polymeric materials for solder

Working With BGAs: Design And Layout

BGA-Void-Last-Will

Microsectioning inspection of assembled capacitors

Microsectioning inspection of assembled capacitors

Recent developments in advanced polymeric materials for solder

Micromachines, Free Full-Text

A Brief Introduction of BGA Package Types

Microsectioning - Short Technical Notes Archives - EEE Parts

What is Package-on-Package (POP) and Its Benefits – FS Tech

Overview of Selected Issues Related to Soldering